JPH0159076B2 - - Google Patents

Info

Publication number
JPH0159076B2
JPH0159076B2 JP56063962A JP6396281A JPH0159076B2 JP H0159076 B2 JPH0159076 B2 JP H0159076B2 JP 56063962 A JP56063962 A JP 56063962A JP 6396281 A JP6396281 A JP 6396281A JP H0159076 B2 JPH0159076 B2 JP H0159076B2
Authority
JP
Japan
Prior art keywords
workpiece
processing
laser beam
cutting
focused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56063962A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57181787A (en
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56063962A priority Critical patent/JPS57181787A/ja
Publication of JPS57181787A publication Critical patent/JPS57181787A/ja
Publication of JPH0159076B2 publication Critical patent/JPH0159076B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP56063962A 1981-04-30 1981-04-30 Laser working method Granted JPS57181787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56063962A JPS57181787A (en) 1981-04-30 1981-04-30 Laser working method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56063962A JPS57181787A (en) 1981-04-30 1981-04-30 Laser working method

Publications (2)

Publication Number Publication Date
JPS57181787A JPS57181787A (en) 1982-11-09
JPH0159076B2 true JPH0159076B2 (en]) 1989-12-14

Family

ID=13244433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56063962A Granted JPS57181787A (en) 1981-04-30 1981-04-30 Laser working method

Country Status (1)

Country Link
JP (1) JPS57181787A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7157038B2 (en) * 2000-09-20 2007-01-02 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
KR101041137B1 (ko) 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20100107253A (ko) 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
DE102011108405A1 (de) * 2011-07-23 2013-01-24 Volkswagen Aktiengesellschaft Verfahren und Vorrichtung zum Einbringen einer Schnittfuge in ein Werkstück
DE102013204222B4 (de) * 2013-03-12 2017-09-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und system zum bearbeiten eines objekts mit einem laserstrahl

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS511836U (en]) * 1974-06-19 1976-01-08

Also Published As

Publication number Publication date
JPS57181787A (en) 1982-11-09

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